Mechanical characterization
Tensile-Compression devices
• 10N-100KN
• various atmospheres and temperature ranges available
Strain measurement : GOM ARAMIS 6M
• 2.5D Motion and Deformation Sensor
• portable
• resolution: 1µm
Compact Nanoindentation plateform (Anton PAAR STEP4) and Optics (x5 x20 x50 x100)
Tensile-compression in-situ device in SEM
• load cell 2000N & 5000N
• sample size: 29x27x5mm (LxBxH)
• Tmax=500°C
• 10N-100KN
• various atmospheres and temperature ranges available
Strain measurement : GOM ARAMIS 6M
• 2.5D Motion and Deformation Sensor
• portable
• resolution: 1µm
Compact Nanoindentation plateform (Anton PAAR STEP4) and Optics (x5 x20 x50 x100)
| Ultra Nano Hardness Tester (UNHT3) | Wide Scan Atomic Force Microscope (AFM) | Micro Combi Tester (MCT3) |
| • Negligible thermal drift • Depth resolution : 0,001nm • Load resolution : 0,01µN • Max load : 100mN • Max depth 50µm • Tips : - Berkovich - Cube corner - Spheres (1µm & 10µm)  |
• Scan area 110 µm x 110 µm • Max vertical depth 22µm • Optical top and side view of the cantilever • Contact mode and Non contact dynamic mode • Dynamic frequency range 15-300kHz  |
• Micro scratch + Microindentation • Max Load : 30N • Max Friction Load : 30N • Max penetration depth : 1mm • Max scratch length : 4mm • Tips : - Sphere 100µm (scratch) - Vickers (indentation)  |
• load cell 2000N & 5000N
• sample size: 29x27x5mm (LxBxH)
• Tmax=500°C
Microstructural characterization
X-ray nanotomography: RX solutions
• resolution: 0.25µm – 100µm
• ex-situ or post-mortem characterization
• multi-partners facility (UGA)
In-situ thermo-mechanical characterization developments
Dilatometry
• Optical Dilatometry with constrained sintering (load 50 N)
• TMA, TGA, TDA
• various atmospheres
• ceramics, metals
Digital microscope, Olympus DSX 510
• resolution 200 nm
• large image capture possibilities
• 2D and 3D image capture
• resolution: 0.25µm – 100µm
• ex-situ or post-mortem characterization
• multi-partners facility (UGA)
In-situ thermo-mechanical characterization developments
|
nanotomography
 |
microtomography
 |
microtomography with additionnal manufacturing |
• Optical Dilatometry with constrained sintering (load 50 N)
• TMA, TGA, TDA
• various atmospheres
• ceramics, metals
 |
 |
 |
Digital microscope, Olympus DSX 510
• resolution 200 nm
• large image capture possibilities
• 2D and 3D image capture
Material processing
Additive manufacturing: Electron Beam Melting
• Two ARCAM A1 EBM machines
• Titanium alloys, new materials (Cu, Al, …)
• in-situ characterization
Conventional, Induction and microwave sintering
• direct induction heating
• microwave
• metal, ceramics powders
Amorphous metallic alloys
• ultra pure material elaboration
• injection
• surface texturation
• strong link with VULKAM start-up for processing
• Two ARCAM A1 EBM machines
• Titanium alloys, new materials (Cu, Al, …)
• in-situ characterization
Conventional, Induction and microwave sintering
• direct induction heating
• microwave
• metal, ceramics powders
Amorphous metallic alloys
• ultra pure material elaboration
• injection
• surface texturation
• strong link with VULKAM start-up for processing
Personnel technique
- X. Bataillon
- Ch. Josserond
- F. Pelloux
- C. Rajon